Electronic device

ABSTRACT

An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to an electronic device with a metalterminal.

2. Description of the Related Art

In addition to a normal chip component that is solely directly mountedon a board, as shown in Patent Document 1 for example, a chip componentattached with a metal terminal is proposed as an electronic device, suchas a ceramic capacitor.

It is reported that the electronic device attached with a metal terminalafter being mounted has a reduction effect on a deformation stress thattravels from a board to a chip component and a protection effect on achip component from impacts or so. Thus, the electronic device attachedwith a metal terminal is used in a field where durability, reliability,and the like are required.

In conventional electronic devices with a metal terminal, however,terminal electrodes of chip components are connected by solder or so forarrangement of a plurality of chip components in series as shown inPatent Document 1. Thus, if a stress is generated due to deformation andvibration of a substrate or so, cracks are generated in the chipcomponents, and the connection between each of the chip components maybe released.

Patent Document 1: JP2000235931 (A)

SUMMARY OF THE INVENTION

The present invention has been achieved under such circumstances. It isan object of the invention to provide an electronic device capable ofsufficiently securing a joint reliability between each chip component.

To achieve the above object, an electronic device according to thepresent invention includes:

a plurality of chip components;

an intermediate metal terminal configured to connect end surfaces ofterminal electrodes of the chip components; and

an outer metal terminal connectable to the terminal electrode positionedopposite to the terminal electrode connectable to the intermediate metalterminal.

The electronic device of the present invention includes an intermediatemetal terminal configured to connect end surfaces of terminal electrodesof the chip components. Since the chip components are connected via theintermediate metal terminal, even if a substrate is deformed, vibrated,or the like after the electronic device is mounted, a stress actingbetween the chip components is reduced. Thus, cracks are hard to begenerated between the chip components, and a joint reliability betweeneach chip component can efficiently be secured.

A terminal electrode of a chip component differing from the plurality ofchip components may be connected to one surface or the other surface ofthe intermediate metal terminal. In this structure, the plurality ofchip components can be connected in parallel via the intermediate metalterminal, and the electronic device of the present invention can have ahigh capacitance in case of using, for example, capacitors as the chipcomponents.

The intermediate metal terminal may include a plurality of holdingpieces for sandwiching and holding the chip components. In thisstructure, the chip components are hard to fall off from theintermediate metal terminal, and a stress acting between each of thechip components is further reduced. Thus, a joint reliability betweeneach of the chip components can effectively be secured.

Preferably, the holding pieces are respectively formed on one end or theother end of the intermediate metal terminal and are arranged to beshifted so as not to overlap with each other when viewed from one end orthe other end of the intermediate metal terminal. In this structure, astress acting between each of the chip components is further reduced,and a joint reliability between each of the chip components caneffectively be secured.

Preferably, each of the holding pieces is in contact with the singlechip component or the multiple chip components. In this structure, eachof the chip components can be sandwiched and held by the holding piecein contact with the single chip component and the holding piece incontact with the multiple chip components. Thus, each of the chipcomponents can stably be held, and a joint reliability between each ofthe chip components and the intermediate metal terminal can sufficientlybe secured.

Preferably, the holding piece in contact with the multiple chipcomponents is wider than the holding piece in contact with the singlechip component. In this structure, the holding piece in contact with themultiple chip components has an increased contact area therewith and canstably hold each of the chip components, and a joint reliability betweeneach of the chip components can effectively be secured.

Preferably, the electronic device includes a pair of outer metalterminals, and each of the multiple holding pieces protrudes toward oneof the outer metal terminals or the other outer metal terminal. In thisstructure, the chip component disposed near one of the outer metalterminal and the chip component disposed near the other outer metalterminal can stably be held, and a joint reliability between each of thechip components can effectively be secured.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic perspective view illustrating a ceramicelectronic device according to an embodiment of the present invention.

FIG. 1B is a schematic perspective view illustrating an intermediatemetal terminal and outer metal terminals shown in FIG. 1A.

FIG. 1C is a schematic perspective view illustrating a variation of theintermediate metal terminal shown in FIG. 1B.

FIG. 1D is a schematic perspective view illustrating another variationof the intermediate metal terminal shown in FIG. 1B.

FIG. 2 is a front view of the ceramic electronic device shown in FIG.1A.

FIG. 3A is a left-side view of the ceramic electronic device shown inFIG. 1A.

FIG. 3B is a left-side view of a ceramic electronic device according toa variation of the embodiment shown in FIG. 3A.

FIG. 3C is a left-side view of a ceramic electronic device according toanother embodiment of the present invention.

FIG. 3D is a left-side view of a ceramic electronic device according tofurther another embodiment of the present invention.

FIG. 4 is a top view of the ceramic electronic device shown in FIG. 1A.

FIG. 5 is a bottom view of the ceramic electronic device shown in FIG.1A.

FIG. 6 is a cross-sectional view perpendicular to the Y-axis of theceramic electronic device shown in FIG. 1A.

FIG. 7A is a schematic perspective view illustrating a ceramicelectronic device according to another embodiment of the presentinvention.

FIG. 7B is a schematic perspective view illustrating a ceramicelectronic device according to further another embodiment of the presentinvention.

FIG. 8 is a schematic perspective view illustrating a ceramic electronicdevice according to further another embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, the present invention is described based on embodimentsshown in the figures.

First Embodiment

FIG. 1A is a schematic perspective view illustrating a capacitor 10 asan electronic device according to First Embodiment of the presentinvention. The capacitor 10 has capacitor chips 20 as chip components, apair of outer metal terminals 30 and 40, and an intermediate metalterminal 60. The capacitor 10 according to First Embodiment has fourcapacitor chips 20, but the capacitor 10 may have any plural capacitorchips 20.

Incidentally, each embodiment is described with a capacitor where thecapacitor chips 20 are equipped with the outer metal terminals 30 and 40and the intermediate metal terminal 60, but the ceramic electronicdevice of the present invention is not limited to this capacitor and maybe a chip component other than capacitors equipped with the outer metalterminals 30 and 40 and the intermediate metal terminal 60.

In the figures, the X-axis, the Y-axis, and the Z-axis are perpendicularto each other. The X-axis is parallel to a direction where the capacitorchips 20 are arranged as shown in FIG. 1A, the Z-axis corresponds with aheight direction of the capacitor 10 from a mount surface, and theY-axis corresponds with a direction where a pair of terminal electrodes22 and 24 of the chip 20 is mutually arranged on the opposite side.

The capacitor chips 20 have an approximately rectangular parallelepipedshape, and each of the four capacitor chips 20 has approximately thesame shape and size. As shown in FIG. 2, the capacitor chips 20 have apair of chip end surfaces facing each other, and the pair of chip endsurfaces consists of a first end surface 20 a and a second end surface20 b. As shown in FIG. 1A, FIG. 2, and FIG. 4, the first and second endsurfaces 20 a and 20 b have an approximately rectangular shape. In foursides constituting each rectangle of the first and second end surfaces20 a and 20 b, a pair of longer sides is chip first sides 20 g (see FIG.2), and a pair of shorter sides is chip second sides 20 h (see FIG. 4).

The capacitor chips 20 are arranged so that the first end surfaces 20 aand the second end surfaces 20 b are perpendicular to a mount surface.In other words, the chip third sides 20 j (see FIG. 2) of the capacitorchips 20 connecting between the first end surfaces 20 a and the secondend surfaces 20 b are parallel to the mount surface of the capacitor 10.Incidentally, the mount surface of the capacitor 10 is a surfaceattached with the capacitor 10 by solder or so and facing mount portions38 and 48 of the outer metal terminals 30 and 40 mentioned below, and isa parallel surface to the X-Y plane shown in FIG. 1A.

Compared a length L1 of the chip first side 20 g shown in FIG. 2 with alength L2 of the chip second side 20 h shown in FIG. 4, the chip secondside 20 h is shorter than the chip first side 20 g (L1>L2). The chipfirst side 20 g and the chip second side 20 h have any length ratio, butL2/L1 is about 0.3 to 0.7, for example.

The capacitor chips 20 are arranged so that the chip first sides 20 gare perpendicular to the mount surface as shown in FIG. 2, and that thechip second sides 20 h are parallel to the mount surface as shown inFIG. 4. In the first to fourth side surfaces 20 c to 20 f (the four chipside surfaces connecting the first end surfaces 20 a and the second endsurfaces 20 b), the first and second side surfaces 20 c and 20 d havelarge areas and are arranged perpendicularly to the mount surface, andthe third and fourth side surfaces 20 e and 20 f have areas that aresmaller than those of the first and second side surfaces 20 c and 20 dand are arranged in parallel to the mount surface. The third sidesurfaces 20 e are upper side surfaces facing the opposite direction tothe mount portions 38 and 48 below, and the fourth sides surfaces 20 fare lower side surfaces facing the mount portions 38 and 48.

As shown in FIG. 1A, FIG. 2, and FIG. 4, first terminal electrodes 22 ofthe capacitor chips 20 are formed to range from the first end surfaces20 a to a part of the first to fourth side surfaces 20 c to 20 f. Thus,the first terminal electrode 22 has a part arranged on the first endsurface 20 a and a part arranged on the first to fourth side surfaces 20c and 20 f.

The second terminal electrodes 24 of the capacitor chips 20 are formedto range from the second end surfaces 20 b to another part of the firstto fourth side surfaces 20 c to 20 f (a different part from the partwhere the first terminal electrodes 22 reach). Thus, the second terminalelectrode 24 has a part arranged on the second end surface 20 b and apart arranged on the first to fourth side surfaces 20 c to 20 f (seeFIG. 1, FIG. 2, and FIG. 4). The first terminal electrodes 22 and thesecond terminal electrodes 24 are arranged with a predetermined distanceon the first to fourth side surfaces 20 c to 20 f.

As shown in FIG. 6, which schematically illustrates an internalstructure of the capacitor chips 20, the capacitor chips 20 are amultilayer capacitor where internal electrode layers 26 and dielectriclayers 28 are laminated. In the internal electrode layers 26, internalelectrode layers 26 connected with the first terminal electrodes 22 andinternal electrode layers 26 connected with the second terminalelectrodes 24 are laminated alternately by sandwiching the dielectriclayers 28.

As shown in FIG. 6, the internal electrode layers 26 of the capacitorchips 20 have a lamination direction that is parallel to the X-axis andperpendicular to the Y-axis. That is, the internal electrode layers 26shown in FIG. 6 are arranged in parallel to the plane of the Z-axis andthe Y-axis and perpendicularly to the mount surface.

The dielectric layers 28 of the capacitor chips 20 are composed of anydielectric material, such as calcium titanate, strontium titanate,barium titanate, and a mixture thereof. Each of the dielectric layers 28has any thickness, but normally has a thickness of 1 μm to severalhundred μm. In the present embodiment, each of the dielectric layers 28preferably has a thickness of 1.0 to 5.0 μm. The dielectric layers 28preferably have a main component of barium titanate, which can increasecapacitance of capacitors.

The internal electrode layers 26 contain any conductive material, butmay contain a comparatively inexpensive base metal when the dielectriclayers 28 are composed of a reduction resistant material. The base metalis preferably Ni or a Ni alloy. The Ni alloy is preferably an alloy ofNi and one or more elements of Mn, Cr, Co, and Al, and preferablycontains Ni at 95 wt % or more. Incidentally, Ni or the Ni alloy maycontain various fine components, such as P, at about 0.1 wt % or less.The internal electrode layers 26 may be formed using a commerciallyavailable electrode paste. Each of the internal electrode layers 26 hasa thickness appropriately determined based on usage or so.

The first and second terminal electrodes 22 and 24 are also composed ofany material. The first and second terminal electrodes 22 and 24 arenormally composed of copper, copper alloy, nickel, nickel alloy, or thelike, but may be composed of silver, an alloy of silver and palladium,or the like. Each of the first and second terminal electrodes 22 and 24also has any thickness, but normally has a thickness of about 10 to 50μm. Incidentally, at least one metal film of Ni, Cu, Sn, etc. may beformed on the surfaces of the first and second terminal electrodes 22and 24.

The capacitor chips 20 have shape and size that are appropriatelydetermined based on object and usage. For example, the capacitor chip 20has a length (L3 shown in FIG. 2) of 1.0 to 6.5 mm, preferably 3.2 to5.9 mm, a width (L1 shown in FIG. 2) of 0.5 to 5.5 mm, preferably 1.6 to5.2 mm, and a thickness (L2 shown in FIG. 4) of 0.3 to 3.5 mm,preferably 0.8 to 3.2 mm. When the capacitor 10 has a plurality ofcapacitor chips 20, each of the capacitor chips 20 may have mutuallydifferent size and shape.

As shown in FIG. 1B, the intermediate metal terminal 60 is presentbetween two capacitor chips 20 arranged on one side in the Y-axisdirection (the positive side in the Y-axis direction with the firstouter metal terminal 30) and two capacitor chips 20 arranged on theother side in the Y-axis direction (the negative side in the Y-axisdirection with the second outer metal terminal 40).

The intermediate metal terminal 60 includes a connection portion 61 andengagement arm portions (holding pieces) 63 a to 63 c and 64 a to 64 c.In the connection portion 61, four capacitor chips 20 are connected. Theengagement arm portions (holding pieces) 63 a to 63 c and 64 a to 64 csandwich and hold the four capacitor chips 20 connected to theconnection portion 61.

The connection portion 61 is as thick as the outer metal terminal 30(40) in the Y-axis direction, but may be different from the outer metalterminal 30 (40) in thickness in the Y-axis direction. The connectionportion 61 includes a first connection surface 611 directed to one sidein the Y-axis direction and a second connection surface 612 directed tothe other side in the Y-axis direction.

The first connection surface 611 and second connection surface 612 havean approximately rectangular or square shape and have a flat shapeparallel to the XZ plane. Among the four capacitor chips 20, the firstconnection surface 611 is connected with the terminal electrodes 24 and24 of the two capacitor chips 20 arranged on one side in the Y-axisdirection, and the second connection surface 612 is connected with theterminal electrodes 22 and 22 of the two capacitor chips 20 arranged onthe other side in the Y-axis direction.

As shown in FIG. 2, a height H of the first connection surface 611 inthe Z-axis direction is substantially equal to a height of the terminalelectrodes 24 of the capacitor chips 20 in the Z-axis direction. Asshown in FIG. 4, a width W1 of the first connection surface 611 in theX-axis direction is approximately twice as large as a width of theterminal electrode 24 of the capacitor chip 20 in the X-axis direction.When the first connection surface 611 has a height H in the Z-axisdirection and a width W1 in the X-axis direction configured as mentionedabove, the two capacitor chips 20 arranged on one side in the Y-axisdirection can be connected to the inner side of the first connectionsurface 611 without protruding to the outside of the intermediate metalterminal 60.

However, the first connection surface 611 does not necessarily have theabove-mentioned height H in the Z-axis direction and the above-mentionedwidth W1 in the X-axis direction, and the two capacitor chips 20arranged on one side in the Y-axis direction may protrude to the outsideof the intermediate metal terminal 60.

As shown in FIG. 2, a height of the second connection surface 612 in theZ-axis direction is equal to a height H of the first connection surface611 in the Z-axis direction. As shown in FIG. 4, a width of the secondconnection surface 612 in the X-axis direction is equal to a width W1 ofthe first connection surface 611 in the X-axis direction. When thesecond connection surface 612 has a height H in the Z-axis direction anda width W1 in the X-axis direction configured as mentioned above, thetwo capacitor chips 20 arranged on the other side in the Y-axisdirection can be connected to the inner side of the second connectionsurface 612 without protruding to the outside of the intermediate metalterminal 60.

However, the second connection surface 612 does not necessarily have theabove-mentioned height H in the Z-axis direction and the above-mentionedwidth W1 in the X-axis direction, and the two capacitor chips 20arranged on the other side in the Y-axis direction may protrude to theoutside of the intermediate metal terminal 60.

In the present embodiment, it is accordingly possible to connect endsurfaces of the terminal electrodes 24 and 24 of the two capacitor chips20 arranged on one side in the Y-axis direction and end surfaces of theterminal electrodes 22 and 22 of the two capacitor chips 20 arranged onthe other side in the Y-axis direction via the intermediate metalterminal 60.

Thus, the two capacitor chips 20 and 20 arranged on one side in theY-axis direction and the two capacitor chips 20 and 20 arranged on theother side in the Y-axis direction can be connected in series via theintermediate metal terminal 60 (by sandwiching the intermediate metalterminal 60).

Moreover, the two capacitor chips 20 on one side in the Y-axis directioncan be connected in parallel, and the two capacitor chips 20 on theother side in the Y-axis direction can be connected in parallel, via theintermediate metal terminal 60 (without sandwiching the intermediatemetal terminal 60). In the present embodiment, the capacitor 10 canthereby have a high capacitance.

As shown in FIG. 1B, all of the engagement arm portions 63 a, 63 b, and63 c protrude toward one side in the Y-axis direction. The engagementarm portions 63 a and 63 b are connected to one end (upper end) of theconnection portion 61 in the Z-axis direction. In the presentembodiment, the engagement arm portions 63 a and 63 b are arranged onboth sides of the upper end of the connection portion 61 in the X-axisdirection. The engagement arm portions 63 a and 63 b are arranged at anyposition as long as they are positioned on both sides of the engagementarm portion 63 c in the X-axis direction.

The engagement arm portion 63 a is in contact with one of the twocapacitor chips 20 connectable with the first connection surface 611,and the engagement arm portion 63 b is in contact with the othercapacitor chip 20 connectable with the first connection surface 611.That is, each of the engagement arm portions 63 a and 63 b is in contactwith the upper part of the second terminal electrode 24 of the singlecapacitor chip 20.

The engagement arm portion 63 c is connected to the other end (lowerend) of the connection portion 61 in the Z-axis direction. In thepresent embodiment, the engagement arm portion 63 c is disposed at anapproximately center of the lower end of the connection portion 61 inthe X-axis direction. The engagement arm portion 63 c is in contact withboth of the second terminal electrodes 24 and 24 of the two capacitorchips 20 connectable with the first connection surface 611. That is, theengagement arm portion 63 c is in contact with the lower parts of thesecond terminal electrodes 24 and 24 of the capacitor chips 20.

Unlike the engagement arm portions 31 a, 31 b, 33 a, and 33 b of thefirst outer metal terminal 30 mentioned below, the engagement armportions 63 a, 63 b, and 63 c are not paired and are arranged to beshifted each other in the X-axis direction. The two capacitor chips 20connectable with the first connection surface 611 can be sandwiched andheld together by the three engagement arm portions 63 a, 63 b, and 63 c.Thus, the capacitor chips 20 can stably be held, and a joint reliabilitybetween each of the capacitor chips 20 and the intermediate metalterminal 60 can sufficiently be secured.

All of the engagement arm portions 64 a, 64 b, and 64 c protrude towardthe other side in the Y-axis direction. The engagement arm portions 64 aand 64 b have the same shape as the engagement arm portions 63 a and 63b. The engagement arm portion 64 c have the same shape as the engagementarm portion 63 c.

The engagement arm portions 64 a and 64 b are connected to the other end(lower end) of the connection portion 61 in the Z-axis direction. In thepresent embodiment, the engagement arm portions 64 a and 64 b arearranged on both sides of the lower end of the connection portion 61 inthe X-axis direction. The engagement arm portions 64 a and 64 b arearranged at any position as long as they are positioned on both sides ofthe engagement arm portion 64 c in the X-axis direction.

The engagement arm portion 64 a is in contact with one of the twocapacitor chips 20 connectable with the second connection surface 612,and the engagement arm portion 64 b is in contact with the othercapacitor chip 20 connectable with the second connection surface 612.That is, each of the engagement arm portions 64 a and 64 b is in contactwith the lower part of the first terminal electrode 22 of the singlecapacitor chip 20.

The engagement arm portion 64 c is connected to one end (upper end) ofthe connection portion 61 in the Z-axis direction. In the presentembodiment, the engagement arm portion 64 c is disposed at anapproximately center of the upper end of the connection portion 61 inthe X-axis direction. The engagement arm portion 64 c is in contact withboth of the first terminal electrodes 22 and 22 of the two capacitorchips 20 connectable with the second connection surface 612. That is,the engagement arm portion 64 c is in contact with the upper parts ofthe first terminal electrodes 22 and 22 of the capacitor chips 20.

Unlike the engagement arm portions 31 a, 31 b, 33 a, and 33 b of thefirst outer metal terminal 30 mentioned below, the engagement armportions 64 a, 64 b, and 64 c are not paired and are arranged to beshifted each other in the X-axis direction. The two capacitor chips 20connectable with the second connection surface 612 can be sandwiched andheld together by the three engagement arm portions 64 a, 64 b, and 64 c.Thus, the capacitor chips 20 can stably be held, and a joint reliabilitybetween each of the capacitor chips 20 and the intermediate metalterminal 60 can sufficiently be secured.

As shown in FIG. 4 and FIG. 5, the engagement arm portions 63 a, 63 b,64 a, and 64 b have a width in the X-axis direction that isapproximately equal to a width in the X-axis direction of the engagementarm portion 31 a or so of the first outer metal terminal 30 mentionedbelow, but the engagement arm portions 63 a, 63 b, 64 a, and 64 b mayhave a width in the X-axis direction that is different from a width inthe X-axis direction of the engagement arm portion 31 a or so of thefirst outer metal terminal 30 mentioned below.

The engagement arm portions 63 c and 64 c in contact with the multiplecapacitor chips 20 are formed more widely in the X-axis directioncompared to the engagement arm portions 63 a, 63 b, 64 a, and 64 b incontact with the single capacitor chip 20. Preferably, each of theengagement arm portions 63 c and 64 c has a width in the X-axisdirection that is approximately 1.1 to 2 times larger than a width ofeach of the engagement arm portions 63 a, 63 b, 64 a, and 64 b in theX-axis direction.

In this structure, each of the engagement arm portions 63 c and 64 c hasan increased contact area with two capacitor chips 20 connected to thefirst connection portion 611 or the second connection portion 612 andcan stably hold each of the capacitor chips 20, and a joint reliabilitybetween each of the capacitor chips 20 can effectively be secured.

As clearly shown by comparing FIG. 4 and FIG. 5, the engagement armportions 63 a and 63 b and the engagement arm portions 64 a and 64 bprotrude in opposite directions in the Y-axis direction, and theengagement arm portion 63 c and the engagement arm portion 64 c protrudein opposite directions in the Y-axis direction. That is, the engagementarm portions 63 a, 63 b, and 64 c and the engagement arm portions 63 c,64 a, and 64 b protrude reversely (asymmetrically) at the upper end andthe lower end of the connection portion 61.

In this structure, two capacitor chips 20 connected to the firstconnection surface 611 and two capacitor chips 20 connected to thesecond connection surface 612 can stably be held, and a jointreliability between each of the capacitor chips 20 can effectively besecured.

In the present embodiment, as shown in FIG. 4, the engagement armportions 63 a, 63 b, and 64 c at the upper end of the connection portion61 protrude in the Y-axis direction in an alternate manner in the X-axisdirection. As shown in FIG. 5, the engagement arm portions 63 c, 64 a,and 64 b at the lower end of the connection portion 61 protrude in theY-axis direction in an alternate manner in the X-axis direction.

As shown in FIG. 1B, the engagement arm portions 63 a to 63 c and 64 ato 64 c are arranged to be shifted (alternately) in the X-axis directionso as not to overlap with each other when viewed from one end or theother end of the intermediate metal terminal 60 in the Z-axis direction.

When the intermediate metal terminal 60 is rotated on the YZ plane by180 degrees, the intermediate metal terminal 60 has a correspondingouter shape before and after the rotation. That is, the intermediatemetal terminal 60 is configured to be point-symmetry in the X-axisdirection or the Z-axis direction with a symmetry point (a center of thefirst connection surface 611 or the second connection surface 612).

The intermediate metal terminal 60 and the terminal electrodes 22 and 24of each of the capacitor chips 20 are connected electrically andmechanically via a conductive connection member (not illustrated), suchas solder and conductive adhesive. Incidentally, the engagement armportions 63 a to 63 c and 64 a to 64 c are not provided with theconductive connection member.

Among the terminal electrodes 22 and 24 of each of the four capacitorchips 20, a pair of outer metal terminals 30 and 40 of the capacitor 10is connected to the terminal electrodes 22 and 24 positioned opposite toterminal electrodes 22 and 24 connected to the intermediate metalterminal 60. That is, the first outer metal terminal 30 (one of the pairof outer metal terminals 30 and 40) is connected to the first terminalelectrodes 22 positioned opposite to the second terminal electrodes 24of the two capacitor chips 20 connected to the first connection surface611 of the intermediate metal terminal 60. Likewise, the second outermetal terminal 40 (the other of the pair of outer metal terminals 30 and40) is connected to the second terminal electrodes 24 positionedopposite to the first terminal electrodes 22 of the two capacitor chips20 connected to the second connection surface 612 of the intermediatemetal terminal 60.

The first outer metal terminal 30 has a terminal body 36, a plurality ofpairs of engagement arm portions (holding pieces) 31 a, 31 b, 33 a, and33 b, and a mount portion 38. The terminal body 36 faces the firstterminal electrodes 22. The engagement arm portions 31 a, 31 b, 33 a,and 33 b sandwich and hold the capacitor chips 20 from both ends of thechip first sides 20 g in the Z-axis direction. The mount portion 38extends from the terminal body 36 toward the capacitor chips 20 and isat least partially approximately perpendicular to the terminal body 36.

As shown in FIG. 2, the terminal body 36 has a substantially rectangularflat shape having a pair of terminal first sides 36 g approximatelyparallel to the chip first sides 20 g perpendicular to the mount surfaceand a pair of terminal second sides 36 ha and 36 hb approximatelyparallel to the chip second sides 20 h parallel to the mount surface asshown in FIG. 3A.

As shown in FIG. 3A, the terminal second sides 36 ha and 36 hb parallelto the mount surface have a length that is several times plus or minusalpha of a length L2 (see FIG. 4) of the chip second sides 20 h arrangedin parallel to the terminal second sides 36 ha and 36 hb. That is, theterminal body 36 has a width in the X-axis that is approximately equalto a length obtained by multiplying the number of capacitor chips 20contained in the capacitor 10 shown in FIG. 3A with a width of thecapacitor chips 20 in the X-axis direction, but the terminal body 36 mayhave a width in the X-axis that is slightly shorter or longer than thislength.

On the other hand, the capacitor 10 according to First Embodiment shownin FIG. 3A includes two capacitor chips 20 on one side or the other sidein the Y-axis direction, and the terminal second sides 36 ha and 36 hbparallel to the mount surface have a length that is the same as orslightly longer than a double of a length L2 of the chip second side 20h arranged in parallel to the terminal second sides 36 ha and 36 hb. Asshown in FIG. 1A, a capacitor chip that can be combined with the outermetal terminals 30 and 40 does not have the only one size, and the outermetal terminals 30 and 40 can constitute an electronic devicecorrespondingly with multiple kinds of capacitor chips 20 havingdifferent lengths in the X-axis direction.

The terminal body 36 is electrically and mechanically connected with thefirst terminal electrodes 22 formed on the first end surfaces 20 afacing the terminal body 36. For example, the terminal body 36 and thefirst terminal electrodes 22 can be connected with each other byarranging a conductive connection member 50, such as a solder and aconductive adhesive, in a space between the terminal body 36 and thefirst terminal electrodes 22 shown in FIG. 2.

Joint regions 50 a are determined as a region where the connectionmember 50 joins the terminal body 36 and the end surfaces of the firstterminal electrodes 22. A non-joint region 50 b is determined as aregion where the terminal body 36 and the end surfaces of the firstterminal electrodes 22 are not joined without the connection member 50,and a space exists between the terminal body 36 and the end surfaces ofthe first terminal electrodes 22. The space between the terminal body 36and the end surfaces of the first terminal electrodes 22 in thenon-joint region 50 b has a thickness that is approximately equal to athickness of the connection member 50. In the present embodiment, theconnection member 50 has a thickness that is determined based on aheight of protrusions 36 a mentioned below or so. A height of the jointregion 50 a in the Z-axis direction shown in FIG. 2 corresponds to afirst predetermined height.

In the present embodiment, first through holes 36 b (see FIG. 1A) areformed on a part of the terminal body 36 facing the first end surfaces20 a. Two first through holes 36 b are formed correspondingly with thecapacitor chips 20 contained in the capacitor 10, but any shape andnumber of first through holes 36 b may be employed. In the presentembodiment, the first through hole 36 b is formed in an approximatelycentral part of the joint region 50 a.

As shown in FIG. 3A, the joint region 50 a is formed by applying theconnection member 50 (see FIG. 2) to initial application regions 50 crespectively positioned on both sides of the first through hole 36 b inthe Z-axis direction. That is, after the connection member 50 isapplied, the joint region 50 a is formed in such a manner that theconnection member 50 applied on the initial application regions 50 cspreads out by bringing a heating element into contact with the outersurface of the terminal body 36 and pushing it against the end surfaceof the chip 20. The non-joint region 50 b is a region where theconnection member 50 is not spread out. In the present embodiment, atotal area of the non-joint region 50 b between the terminal body 36 andthe end surfaces of the terminal electrodes 22 in the Y-axis directionis larger than 3/10, preferably ½ to 10, of a total area of the jointregions 50 a.

In the present embodiment, the connection member 50 composed of a solderforms a solder bridge between a periphery of the first through hole 36 band the first terminal electrode 22, and the terminal body 36 and thefirst terminal electrode 22 can thereby be joined strongly. Moreover, anapplication state of the connection member 50 in the joint region 50 acan be observed from outside via the first through hole 36 b. Moreover,bubbles contained in the connection member 50, such as a solder, can bereleased via the first through hole 36 b. This stabilizes the joint evenif the amount of the connection member 50, such as a solder, is small.

The terminal body 36 is provided with a plurality of protrusions 36 aprotruding toward the first end surface 20 a of the capacitor chip 20and touching the first end surface 20 a so that the plurality ofprotrusions 36 a surrounds the first through hole 36 b. In addition, theprotrusions 36 a may be formed outside the initial application regions50 c, or the initial application regions 50 c may be positioned betweenthe protrusions 36 a and the first through hole 36 b. Incidentally, theinitial application region 50 c may protrude from between the protrusion36 a and the first through hole 36 b.

The protrusions 36 a reduce a contact area between the terminal body 36and the first terminal electrodes 22. This makes it possible to preventa vibration generated in the chip capacitors 20 from traveling to themount board via the first outer metal terminal 30 and prevent anacoustic noise of the ceramic capacitor 10.

The protrusions 36 a are formed around the first through hole 36 b, andthe joint region 50 a formed by the spread of the connection member 50,such as a solder, can thereby be adjusted. In the present embodiment,the joint region 50 a has a periphery positioned slightly outside theprotrusions 36 a. In particular, as shown in FIG. 1A, a lower end of thejoint region 50 a in the Z-axis direction is positioned near an upperopening edge of a second through hole (opening) 36 c mentioned below.

In such a capacitor 10, an acoustic noise can be prevented while aconnection strength between the terminal body 36 and the first terminalelectrodes 22 is adjusted in an appropriate range. Incidentally, fourprotrusions 36 a are formed around one first through hole 36 b in thecapacitor 10, but any number and arrangement of the protrusions 36 a maybe employed.

The terminal body 36 is provided with second through holes (openings) 36c having a periphery portion connected with the lower arm portion 31 bor 33 b (one of multiple pairs of engagement arm portions 31 a, 31 b, 33a, and 33 b). The lower arm portion 31 b or 33 b is formed by a platepiece corresponding to a punched hole (second through hole 36 c) formedon the terminal body 36 and is formed in the middle of the terminal body36 in the Z-axis direction. The second through holes 36 c are positionedcloser to the mount portion 38 than the first through holes 36 b. Unlikethe first through holes 36 b, the second through holes 36 c are notprovided with any connection member, such as a solder. That is, thesecond through holes 36 c are formed in the non-joint region 50 b.

In the first outer metal terminal 30, non-opening regions 36 c 1 arelocated on both sides of each second through hole 36 c in the X-axisdirection with the lower arm portion 31 b (33 b) supporting thecapacitor chip 20. The non-opening regions 36 c 1 function as thenon-joint region 50 b between the first outer metal terminal 30 and theterminal electrodes 22 and have an easily deformable shape. The firstouter metal terminal 30 can thereby effectively demonstrate a reductioneffect on stress generated in the capacitor 10 and an absorption effecton vibration of the capacitor chips 20. Thus, the capacitor 10 havingthe first outer metal terminal 30 can favorably prevent an acousticnoise and have a favorable connection reliability with the mount boardwhen being mounted.

The second through holes 36 c have any shape, but preferably have anopening width in the width direction (a parallel direction (X-axisdirection) to the terminal second sides 36 ha and 36 hb) that is largerthan the first through holes 36 b. When the second through holes 36 chave a large opening width, the first outer metal terminal 30 caneffectively enhance a reduction effect on stress and a prevention effecton acoustic noise. When the first through holes 36 b have an openingwidth that is smaller than the second through holes 36 c, the connectionmember does not spread excessively. As a result, it is possible toprevent an excessive rise in connection strength between each of thecapacitor chips 20 and the terminal body 36 and prevent an acousticnoise.

As shown in FIG. 2, the non-joint regions 50 b (the connection member 50does not exist between the terminal body 36 and the end surfaces of theterminal electrodes 22) are present in the non-opening regions 36 c 1 ofthe terminal body 36 within a height L4 (second predetermined height) ofthe second through holes 36 c in the Z-axis direction shown in FIG. 3A.In the present embodiment, the height L4 (second predetermined height)of the second through holes 36 c in the Z-axis direction substantiallycorresponds to a height of the non-joint regions 50 b in the Z-axisdirection located below the joint regions 50 a in the Z-axis direction.The height L4 may, however, be smaller than a height of the non-jointregions 50 b in the Z-axis direction.

In the present embodiment, the terminal body 36 of the first outer metalterminal 30 may be warped from the end surface of the terminal electrode22 toward the arm portions 31 a and 31 b (holding pieces) in thenon-joint regions 50 b. In the non-joint regions 50 b, a non-joint gap50 d between the terminal body 36 and the end surface of the terminalelectrode 22 consequently becomes larger toward the arm portions 31 aand 31 b.

Incidentally, a minimum width of the non-joint gap 50 d is as large as athickness of the connection member 50. In this range, the arm portions31 a and 31 b continuing to the non-joint region 50 b can have afavorable elasticity and favorably hold the capacitor chip 20, the outermetal terminal 30 can easily elastically be deformed, and an acousticnoise phenomenon can effectively be prevented.

In the present embodiment, each of the second through holes 36 c formedper chip 20 has a width in the X-axis direction that is preferablysmaller than a width of each chip 20 in the X-axis direction. In thepresent embodiment, each of the second through holes 36 c has a width inthe X-axis direction that is preferably ⅙ to ⅚, more preferably ⅓ to ⅔,of a width of each chip 20 in the X-axis direction.

In the terminal body 36, the second through hole 36 c connected with thelower arm portion 31 b is formed with a predetermined distance in theheight direction against the terminal second side 36 hb connected withthe mount portion 38, and a slit 36 d is formed between the secondthrough hole 36 c and the terminal second side 36 hb.

In the terminal body 36, the slit 36 d is formed between a connectionposition of the lower arm portion 31 b positioned near the mount portion38 with the terminal body 36 (a lower side of a periphery portion of thesecond through hole 36 c) and the terminal second side 36 hb connectedwith the mount portion 38. The slits 36 d extend in a parallel directionto the terminal second sides 36 ha and 36 hb. The slits 36 d can preventa solder used at the time of mounting the capacitor 10 on a mount boardfrom creeping up on the terminal body 36 and prevent a formation of asolder bridge connected with the lower arm portions 31 b and 33 b or thefirst terminal electrodes 22. Thus, the capacitor 10 with the slits 36 ddemonstrates a prevention effect on acoustic noise.

As shown in FIG. 1A and FIG. 2, the engagement arm portions 31 a, 31 b,33 a, and 33 b of the first outer metal terminal 30 extend from theterminal body 36 to the third or fourth side surface 20 e or 20 f (chipside surface of the capacitor chips 20). The lower arm portion 31 b (33b) (one of the engagement arm portions 31 a, 31 b, 33 a, and 33 b) isformed by being bent from the lower edge of the second through hole 36 cin the Z-axis direction formed on the terminal body 36. The upper armportion 31 a (33 a) (another one of the engagement arm portions 31 a, 31b, 33 a, and 33 b) is formed by being bent from the terminal second side36 ha at the upper part of the terminal body 36 (positive side in theZ-axis direction). That is, in the present embodiment, the upper armportion 31 a (33 a) is formed at the upper end of the terminal body 36in the Z-axis direction.

In the present embodiment, the upper arm portion 31 a (33 a) has a widthin the X-axis direction that is equal to a width of the lower armportion 31 b (33 b) in the X-axis direction. The upper arm portion 31 a(33 a) may, however, have a width in the X-axis direction that isdifferent from a width of the lower arm portion 31 b (33 b) in theX-axis direction.

As shown in FIG. 1A, the terminal body 36 has a chip facing part 36 jand a terminal connection part 36 k. The chip facing part 36 j faces thefirst end surfaces 20 a of the capacitor chips 20 and is positioned at aheight overlapping with the first end surfaces 20 a. The terminalconnection part 36 k is positioned below the chip facing part 36 j andis located at a position connecting between the chip facing part 36 jand the mount portion 38.

The second through holes 36 c are formed so that their peripheryportions range the chip facing part 36 j and the terminal connectionpart 36 k. The lower arm portions 31 b and 33 b extend from the terminalconnection part 36 k. That is, bases of the lower arm portions 31 b and33 b are connected with lower sides (opening edges close to the mountportion 38) of approximately rectangular periphery portions of thesecond through holes 36 c.

The lower arm portions 31 b and 33 b extend from the bases toward insidein the Y-axis direction (toward the central parts of the chips 20) whilebeing bent, touch the fourth side surfaces 20 f of the capacitor chips20, and support the capacitor chips 20 from below (see FIG. 2).Incidentally, the lower arm portions 31 b and 33 b may tilt upward inthe Z-axis direction from the lower sides of the periphery portions ofthe second through holes 36 c before the chips 20 are attached. Thisenables the lower arm portions 31 b and 33 b to touch the fourth sidesurfaces 20 f of the chips 20 due to the resilience of the lower armportions 31 b and 33 b.

Lower edges (chip second sides 20 h below) of the first end surfaces 20a of the capacitor chips 20 are positioned slightly above the lowersides of the periphery portions of the second through holes 36 c (thebases of the lower arm portions 31 b and 33 b). When the capacitor chips20 are viewed in the Y-axis direction as shown in FIG. 3A, the loweredges (chip second sides 20 h below) of the first end surfaces 20 a ofthe capacitor chips 20 can be recognized from the side of the capacitor10 via the second through holes 36 c.

As shown in FIG. 1A, a pair of upper arm portion 31 a and lower armportion 31 b holds one capacitor chip 20, and a pair of upper armportion 33 a and lower arm portion 33 b holds another one capacitor chip20. Since a pair of upper arm portion 31 a and lower arm portion 31 b(or upper arm portion 33 a and lower arm portion 33 b) holds onecapacitor chip 20, not multiple capacitor chips 20, the first outermetal terminal 30 can definitely hold each of the capacitor chips 20.

The pair of upper arm portion 31 a and lower arm portion 31 b does nothold the capacitor chip 20 from both ends of the chip second sides 20 h(shorter sides of the first end surface 20 a), but holds the capacitorchip 20 from both ends of the chip first sides 20 g (longer sides of thefirst end surface 20 a). This increases a distance between the upper armportion 31 a (33 a) and the lower arm portion 31 b (33 b) and easilyabsorbs a vibration of the capacitor chip 20. Thus, the capacitor 10 canfavorably prevent an acoustic noise. Incidentally, since the lower armportions 31 b and 33 b extend from the terminal connection part 36 k,the capacitor chips 20 have a short transmission path between the firstterminal electrodes 22 and the mount board, compared to when the lowerarm portions 31 b and 33 b are connected with the chip facing part 36 j.

The mount portion 38 is connected with the terminal second side 36 hbbelow in the terminal body 36 (negative side in the Z-axis direction).The mount portion 38 extends from the terminal second side 36 hb belowtoward the capacitor chips 20 (negative side in the Y-axis direction)and is bent approximately perpendicularly to the terminal body 36.Incidentally, the top surface of the mount portion 38 (a surface of themount portion 38 closer to the capacitor chips 20) preferably has asolder wettability that is lower than a solder wettability of the bottomsurface of the mount portion 38 in order to prevent an excessivescattering of a solder used for mounting the capacitor chips 20 on aboard.

The mount portion 38 of the capacitor 10 is mounted on a mount surface,such as a mount board, in a position facing downward as shown in FIG. 1Aand FIG. 2. Thus, a length of the capacitor 10 in the Z-axis directioncorresponds to a height of the capacitor 10 when it is mounted. In thecapacitor 10, the mount portion 38 is connected with the terminal secondside 36 hb on one side of the terminal body 36, and the upper armportions 31 a and 33 a are connected with the terminal second side 36 haon the other side of the terminal body 36. Thus, the capacitor 10 has nounnecessary part of the length in the Z-axis direction and isadvantageous for low profile.

Since the mount portion 38 is connected with the terminal second side 36hb on one side of the terminal body 36, the capacitor 10 can have asmall projected area in the Z-axis direction and have a small mountarea, compared to prior arts where the mount portion 38 is connectedwith the terminal first sides 36 g of the terminal body 36. Since thethird and fourth side surfaces 20 e and 20 f having small areas amongthe first to fourth side surfaces 20 c to 20 f of the capacitor chips 20are arranged in parallel to the mount surface as shown in FIG. 1A, FIG.5, etc., the capacitor 10 can have a small mount area even if thecapacitor chips 20 are not overlapped with each other in the heightdirection.

As shown in FIG. 1A and FIG. 2, the second outer metal terminal 40 has aterminal body 46, a plurality of pairs of engagement arm portions 41 a,41 b, 43 a, and 43 b, and a mount portion 48. The terminal body 46 facesthe second terminal electrodes 24. The engagement arm portions 41 a, 41b, 43 a, and 43 b sandwich and hold the capacitor chips 20 from bothends of the chip first sides 20 g in the Z-axis direction. The mountportion 48 extends from the terminal body 46 toward the capacitor chips20 and is at least partially approximately perpendicular to the terminalbody 46.

As is the case with the terminal body 36 of the first outer metalterminal 30, the terminal body 46 of the second outer metal terminal 40has a pair of terminal first sides 46 g approximately parallel to thechip first sides 20 g and a terminal second side 46 ha approximatelyparallel to the chip second sides 20 h. The terminal body 46 is providedwith protrusions (not illustrated), first through holes (notillustrated), second through holes (not illustrated), and slits 46 d(see FIG. 6), all of which are similar to the protrusions 36 a, thefirst through holes 36 b, the second through holes 36 c, and the slits36 d formed on the terminal body 36.

As shown in FIG. 1A, the second outer metal terminal 40 is arrangedsymmetrically to the first outer metal terminal 30 and is different fromthe first outer metal terminal 30 in arrangement against the capacitorchips 20. The second outer metal terminal 40 is, however, different fromthe first outer metal terminal 30 only in arrangement against thecapacitor chips 20 and has a similar shape to the first outer metalterminal 30. Thus, the second outer metal terminal 40 is not describedin detail.

The first outer metal terminal 30 and the second outer metal terminal 40are composed of any conductive metal material, such as iron, nickel,copper, silver, and an alloy thereof. In particular, the first andsecond outer metal terminals 30 and 40 are preferably composed of copperin consideration of restraining resistivity of the first and secondouter metal terminals 30 and 40 and reducing ESR of the capacitor 10.

Method of Manufacturing Multilayer Capacitor Chip 20

Hereinafter, a method of manufacturing the capacitor 10 is described.

In the manufacture of the multilayer capacitor chip 20, a laminated bodyis prepared by laminating green sheets (to be the dielectric layers 28after firing) with electrode patterns to be the internal electrodelayers 26 after firing, and a capacitor element body is obtained bypressurizing and firing the obtained laminated body. Moreover, the firstand second terminal electrodes 22 and 24 are formed on the capacitorelement body by baking and plating a terminal electrode paint, and thecapacitor chip 20 is thereby obtained.

A paint for green sheets and a paint for internal electrode layers (rawmaterials of the laminated body), a raw material of the terminalelectrodes, firing conditions of the laminated body and the electrodes,and the like are not limited and can be determined with reference toknown methods or so. In the present embodiment, ceramic green sheetswhose main component is barium titanate are used as a dielectricmaterial. In the terminal electrodes, a Cu paste is immersed and bakedto form a baked layer, and a Ni plating treatment and a Sn platingtreatment are conducted, whereby Cu baked layer/Ni plating layer/Snplating layer is formed.

Method of Manufacturing Outer Metal Terminals 30 and 40 and IntermediateMetal Terminal 60

In the manufacture of the first outer metal terminal 30, a metal plateis initially prepared. The metal plate is composed of any conductivemetal material, such as iron, nickel, copper, silver, and an alloythereof. Next, the metal plate is machined into intermediate membershaving shapes of the engagement arm portions 31 a to 33 b, the terminalbody 36, the mount portion 38, reinforcement pieces 36 f, and the like.

Next, a metal film is formed by plating on the surfaces of theintermediate members formed by machining, and the first outer metalterminal 30 is obtained. Any material, such as Ni, Sn, and Cu, is usedfor the plating. In the plating treatment, a resist treatment against atop surface of the mount portion 38 can prevent the plating fromattaching to the top surface of the mount portion 38. This makes itpossible to generate a difference in solder wettability between the topsurface and the bottom surface of the mount portion 38. Incidentally, asimilar difference can be generated by conducting a plating treatmentagainst the entire intermediate members for formation of a metal filmand removing only the metal film formed on the top surface of the mountportion 38 using a laser exfoliation or so.

In the manufacture of the first outer metal terminals 30, a plurality offirst outer metal terminals 30 may be formed in a state of beingconnected with each other from a metal plate continuing in belt shape.The plurality of first outer metal terminals 30 connected with eachother is cut into pieces before or after being connected with thecapacitor chip 20. Incidentally, the warp of the outer metal terminal 30in the non-joint region 50 b shown in FIG. 2 may be formed at the sametime when or after a plurality of first outer metal terminals 30 isformed in a mutually connected state from a metal plate membercontinuing in a belt state. The second outer metal terminal 40 ismanufactured in a similar manner to the first outer metal terminal 30.

In the manufacture of the intermediate metal terminal 60, a metal plateis machined to obtain an intermediate member provided with shapes of theconnection portion 61, the engagement arm portions 63 a to 63 c and 64 ato 64 c, and the like, and the above-mentioned plating treatment iscarried out for this intermediate member, at a manufacturing step of theintermediate member.

Assembly of Capacitor 10

Four capacitor chips 20 obtained in the above-mentioned manner areprepared, and two capacitor chips 20 of the four capacitor chips 20 areheld so that the second side surface 20 d and the first side surface 20c are arranged to contact with each other as shown in FIG. 1A. Then, endsurfaces of the second terminal electrodes 24 in the Y-axis direction ofthe two capacitor chips 20 are faced with the first connection surface611 of the intermediate metal terminal 60 shown in FIG. 1B. At thistime, a solder, a conductive adhesive, or the like is applied to the endsurfaces of the second terminal electrodes 24 in the Y-axis direction ofthe two capacitor chips 20 arranged on one side in the Y-axis direction(positive side in the Y-axis direction) or to the first connectionsurface 611 of the intermediate metal terminal 60. After that, the firstconnection surface 611 is pushed against the end surfaces of the twocapacitor chips 20, and the intermediate metal terminal 60 is therebyelectrically and mechanically connected to the second terminalelectrodes 24 of the two capacitor chips 20.

Next, the other two capacitor chips 20 are held so that the second sidesurface 20 d and the first side surface 20 c are arranged to contactwith each other as shown in FIG. 1A. Then, the end surfaces of the firstterminal electrodes 22 in the Y-axis direction of the two capacitorchips 20 are faced with the second connection surface 612 of theabove-mentioned intermediate metal terminal 60. At this time, a solder,a conductive adhesive, or the like is applied to the end surfaces of thefirst terminal electrodes 22 in the Y-axis direction of the twocapacitor chips 20 arranged on the other side in the Y-axis direction(negative side in the Y-axis direction) or to the second connectionsurface 612 of the intermediate metal terminal 60. After that, thesecond connection surface 612 is pushed against the end surfaces of thetwo capacitor chips 20, and the intermediate metal terminal 60 isthereby electrically and mechanically connected to the first terminalelectrodes 22 of the capacitor chips 20.

Through the above-mentioned steps, the second terminal electrodes 24 ofthe two capacitor chips 20 are connected to the first connection surface611, and the first terminal electrodes 22 of the two capacitor chips 20are connected to the second connection surface 612.

Next, the end surfaces of the first terminal electrodes 22 in the Y-axisdirection of the two capacitor chips 20 connected to the firstconnection surface 611 are faced with a rear surface of the first outermetal terminal 30, and the end surfaces of the second terminalelectrodes 24 in the Y-axis direction of the two capacitor chips 20connected to the second connection surface 612 are faced with the secondouter metal terminal 40.

At this time, the connection member 50 (see FIG. 2), such as solder, isapplied to the initial application regions 50 c shown in FIG. 1A andFIG. 3A on the end surfaces of the first terminal electrodes 22 in theY-axis direction of the two capacitor chips 20 connected to the firstconnection surface 611 or on the rear surface of the first outer metalterminal 30. Likewise, the connection member 50 (see FIG. 2), such assolder, is applied at positions corresponding to the initial applicationregions 50 c shown in FIG. 1A and FIG. 3A on the end surfaces of thesecond terminal electrodes 24 in the Y-axis direction of the twocapacitor chips 20 connected to the second connection surface 612 or onthe rear surface of the second outer metal terminal 40.

After that, the joint region 50 a is formed in such a manner that theconnection member 50 applied on the initial application regions 50 cspreads out by bringing a heating element into contact with the outersurface of the terminal body 36 (46) and pushing it against the endsurface of the chip 20. The non-joint region 50 b is a region where theconnection member 50 is not spread out. Thus, the capacitor 10 isobtained by electrically and mechanically connecting the first outermetal terminal 30 to the first terminal electrode 22 and 22 of the twocapacitor chips 20 connected to the first connection surface 611 of theintermediate metal terminal 60 and electrically and mechanicallyconnecting the second outer terminal 40 to the second terminalelectrodes 24 and 24 of the two capacitor chips 20 connected to thesecond connection surface 612 of the intermediate metal terminal 60.

Incidentally, each of the metal terminals 30, 40, and 60 is notnecessarily connected to each of the capacitor chips 20 in theabove-mentioned order and may be connected to each of the capacitorchips 20, for example, in reverse order. Instead, each of the metalterminals 30, 40, and 60 may simultaneously be connected to each of thecapacitor chips 20.

In the capacitor 10 obtained as described above, a height direction(Z-axis direction) of the capacitor 10 is identical to directions of thechip first sides 20 g (longer sides of the capacitor chips 20), and themount portions 38 and 48 are formed by being bent from the terminalsecond side 36 hb toward below the capacitor chips 20. Thus, thecapacitor 10 has a small projected area in the height direction (Z-axisdirection) of the capacitor 10 (see FIG. 4 and FIG. 5) and can have asmall mount area.

In the capacitor 10, a plurality of capacitor chips 20 is arranged sideby side in the parallel direction to the mount surface. In the capacitor10, for example, only one capacitor chip 20 is held in the engagementdirection (Z-axis direction) between a pair of engagement arm portions31 a and 31 b. Thus, the capacitor 10 has a high connection reliabilitybetween each of the capacitor chips 20 and the outer metal terminals 30and 40 and has a high reliability for impact and vibration.

Moreover, since a plurality of capacitor chips 20 is arranged andlaminated in the parallel direction to the mount surface, the capacitor10 has a short transmission path and can achieve a low ESL. Since thecapacitor chips 20 are held perpendicularly to the lamination directionof the capacitor chips 20, the first and second outer metal terminals 30and 40 can hold the capacitor chips 20 without any problems even if thelength L2 of the chip second side 20 h of the capacitor chips 20 variesdue to change in the lamination number of capacitor chips 20 to be held.Since the first and second outer metal terminals 30 and 40 can hold thecapacitor chips 20 having various lamination numbers, the capacitor 10can flexibly respond to design change.

In the capacitor 10, the upper arm portions 31 a and 33 a and the lowerarm portions 31 b and 33 b sandwich and hold the capacitor chips 20 fromboth ends of the chip first sides 20 g (longer sides of the first endsurfaces 20 a of the capacitor chips 20). Thus, the first and secondouter metal terminals 30 and 40 can effectively demonstrate a restrainteffect on stress, prevent a transmission of vibration from the capacitorchips 20 to the mount board, and prevent an acoustic noise.

In particular, since the lower arm portion 31 b (33 b) is formed bybeing bent from a lower opening edge of the second through hole 36 c,the lower arm portion 31 b (33 b) supporting the capacitor chip 20 andthe terminal body 36 (46) supporting the lower arm portion 31 b (33 b)are elastically easily deformable. Thus, the first and second outermetal terminals 30 and 40 can effectively demonstrate a reduction effecton stress generated in the capacitor 10 and an absorption effect onvibrations.

Since the lower arm portions 31 b and 33 b are formed by being bent atthe lower opening peripheries of the second through holes 36 c, thelower arm portions 31 b and 33 b of the capacitor 10 can be arranged atoverlapping positions with the mount portion 38 in the perpendiculardirection (Z-axis direction) to the mount surface (see FIG. 2 and FIG.5). Thus, the capacitor 10 can have a wide mount portion 38 and isadvantageous for downsizing.

Since the first through holes 36 b are formed, a connection statebetween the first and second outer metal terminals 30 and 40 and thechip capacitors 20 can easily be recognized from outside, and theceramic capacitor 10 can thereby have a reduced quality dispersion andan improved non-defective product ratio.

In the capacitor 10 according to the present embodiment, a pair ofengagement arm portions (holding pieces with elasticity) 31 a, 31 b, 33a, and 33 b (the same applies to 41 a, 41 b, 43 a, and 43 b) of theouter metal terminal 30 (the same applies to the metal terminal 40)particularly sandwich and hold the chips 20 from both sides in theZ-axis direction. In addition, the connection member 50 (see FIG. 2),such as a solder, connects between the metal outer terminals 30 and 40and the chips 20 within a predetermined range of the joint regions 50 a,and the chips 20 and the metal outer terminals 30 and 40 can thereby bejoined definitely and firmly.

The non-joint region 50 b, which does not connect between the terminalbody 36 (46) and the end surfaces of the terminal electrodes 22 (24), isformed between the peripheries of the joint regions 50 a and theengagement arm portions 31 a, 31 b, 33 a, and 33 b (the same applies to41 a, 41 b, 43 a, and 43 b). In the non-joint region 50 b, the terminalbody 36 (46) of the outer metal terminal 30 (40) can freely elasticallybe deformed without being disturbed by the terminal electrodes 22 (24),and stress is reduced. This favorably maintains an elastic property ofthe engagement arm portions 31 a, 31 b, 33 a, and 33 b (41 a, 41 b, 43a, and 43 b) continuing to the non-joint region 50 b, and the chips 20can favorably be held between a pair of engagement arm portions 31 a and31 b and between a pair of engagement arm portions 33 a and 33 b. Inaddition, the outer metal terminal 30 (40) is easily elasticallydeformed, and an acoustic noise phenomenon can be prevented effectively.

A total area of the non-joint region 50 b is larger than 3/10 of a totalarea of the joint regions 50 a and is within a predetermined rangebetween the terminal body 36 (46) and the end surfaces of the terminalelectrodes 22 (24). This structure improves the effects of the presentembodiment.

In the non-joint region 50 b, a non-joint gap 50 d being as thick as theconnection member 50 is present between the terminal body 36 (46) andthe end surface of the terminal electrode 22 (24). In the non-jointregion 50 b, the non-joint gap 50 d between the terminal body 36 (46)and the end surface of the terminal electrode 22 (24) becomes largertoward the arm portions 31 a, 31 b, 33 a, and 33 b (41 a, 41 b, 43 a,and 43 b).

In the non-joint region 50 b, the terminal body 36 (46) of the outermetal terminal 30 (40) can thereby freely elastically be deformedwithout being disturbed by the terminal electrode 22 (24), and stress isreduced. This favorably maintains an elastic property of the engagementarm portions 31 a, 31 b, 33 a, and 33 b (41 a, 41 b, 43 a, and 43 b)continuing to the non-joint region 50 b, and the capacitor chips 20 canfavorably be held by the arm portions. In addition, the outer metalterminal 30 (40) is easily elastically deformed, and an acoustic noisephenomenon can be prevented effectively.

Moreover, as shown in FIG. 3A, the end surfaces of the terminalelectrodes 22 (24) of a plurality of chips 20 may be joined side by sidewith the terminal body 36 (46) in a plurality of joint regions 50 a, andthe non-joint region 50 b is formed between the joint regions 50 aadjacent to each other. In this structure, a pair of outer metalterminals 30 and 40 can easily connect a plurality of chips 20, and anacoustic noise phenomenon can be prevented due to the existence of thenon-joint region 50 b existing between the chips 20.

Moreover, in the present embodiment, the terminal body 36 (46) isprovided with the second through holes 36 c going through the front andback surfaces of the terminal body 36 (46) in the non-joint region 50 b.The arm portions 31 b and 33 b (41 b and 43 b) extend from the openingperipheries of the second through holes 36 c. Since the second throughholes 36 c are formed, the non-joint region 50 b can be formed easily,the arm portions 31 b and 33 b (41 b and 43 b) can be formed easily, andthe chips 20 are held firmly.

Moreover, in the present embodiment, the protrusions 36 a protrudingtoward the end surface of the terminal electrode 22 (24) are formed onthe inner surface of the terminal body 36 (46). This structure caneasily control the joint region 50 a of the connection member 50 andalso easily control a thickness of the joint region 50 a. In addition,this structure stabilizes the connection of the connection member evenif the amount of the connection member is small.

In the present embodiment, vibrations do not travel from the chips 20 tothe outer metal terminal 30 in the second through holes 36 c. Althoughvibrations are easily generated by electrostrictive phenomenon in thechips 20, particularly in a part where the internal electrodes 26 of thechip 20 are laminated via the dielectric layers, vibrations can beprevented from traveling in the second through holes 36 c in the presentembodiment.

In the present embodiment, as shown in FIG. 2, the non-joint region 50 b(the connection member 50 is not present between the terminal body 36and the end surfaces of the terminal electrodes 22) is present in thenon-opening region 36 c 1 of the terminal body 36 within a predeterminedheight L4 in the Z-axis direction corresponding to the second throughholes 36 c shown in FIG. 3A. In the non-joint region 50 b, the terminalbody 36 of the outer metal terminal 30 can freely elastically bedeformed without being disturbed by the terminal electrodes 22, andstress is reduced. This favorably maintains an elastic property of thelower arm portions 31 b and 33 b as the holding pieces continuing to thenon-opening regions 36 c 1, and the chips 20 can favorably be held bythe lower arm portions 31 b and 33 b. In addition, the outer metalterminal 30 is easily elastically deformed, and an acoustic noisephenomenon can be prevented effectively.

Moreover, the lower arm portions 31 b and 33 b are formed in the secondthrough holes 36 c near the mount portion in the present embodiment. Inthis structure, electrostrictive strain vibrations of the internalelectrodes 26 can be prevented from traveling to the outer metalterminal 30 near the mount portion 38. The lower arm portions 31 b and33 b are hard to be influenced by the electrostrictive strain vibrationsand can securely hold the chips 20.

In the present embodiment, the lower arm portion 31 b (33 b) is formedby being bent from an opening edge of the second through hole 36 c. Inthis structure, the second through hole 36 c and the lower arm portion31 b (33 b) can easily be formed and arranged closely, and it ispossible to more effectively prevent a vibration transmission from thechips 20 to the metal terminal 30 and a vibration transmission from themetal terminal 30 to the mount board.

In particular, as shown in FIG. 2, since the arm portions 31 a and 31 band the arm portions 33 a and 33 b of the outer metal terminal 30 holdeach of the capacitor chips 20, and since the outer metal terminal 30and the capacitor chips 20 are connected in the joint regions 50 a witha predetermined range by the connection member 50, such as solder, thecapacitor chips 20 and the outer metal terminal 30 can securely andfirmly be connected in the capacitor 10 according to the presentembodiment.

As shown in FIG. 1B, the capacitor 10 according to the presentembodiment includes the intermediate metal terminal 60. When thecapacitor chips 20 are connected via the intermediate metal terminal 60,even if a substrate is deformed, vibrated, or the like after thecapacitor 10 is mounted, a stress acting between each of the capacitorchips 20 is reduced. Thus, cracks are hard to be generated between eachof the capacitor chips 20, and a joint reliability between each of thecapacitor chips 20 can efficiently be secured.

In the present embodiment, the intermediate metal terminal 60 includes aplurality of engagement arm portions 63 a to 63 c and 64 a to 64 c forsandwiching and holding each of the capacitor chips 20. In thisstructure, the capacitor chips 20 are hard to fall off from theintermediate metal terminal 60, and a stress acting between each of thecapacitor chips 20 is further reduced. Thus, a joint reliability betweeneach of the capacitor chips 20 can effectively be secured.

In the present embodiment, the engagement arm portions 63 a to 63 c and64 a to 64 c are arranged to be shifted so as not to overlap with eachother when viewed from one end or the other end of the intermediatemetal terminal 60 in the Z-axis direction. In this structure, a stressacting on the capacitor chips 20 is further reduced, and a jointreliability between each of the capacitor chips 20 can effectively besecured.

Second Embodiment

FIG. 7A is a schematic perspective view of a capacitor 10 a according toa variation of the capacitor 10 shown in FIG. 1A. In the outer metalterminal 30 of the capacitor 10 a shown in FIG. 7A, a base of the upperarm portion 31 a (a boundary between the arm portion 31 a and theterminal body 36) among the pair of arm portions 31 a and 31 b (the sameapplies to the arm portions 33 a and 33 b/the same applies hereinafter)is narrower than the lower arm portion 31 b.

In this structure, the pair of arm portions 31 a and 31 b stably holdsthe capacitor chip 20, and the capacitor chip 20 and the outer metalterminal 30 can securely and firmly be connected. Other structure of thepresent embodiment is similar to First Embodiment and demonstratessimilar effects to First Embodiment.

In the capacitor 10 a shown in FIG. 7A, the upper arm portion 31 a (33a) is narrower than the lower arm portion 31 b (33 b) in the X-axisdirection, but the upper arm portion 31 a (33 a) may be wider than thelower arm portion 31 b (33 b) in the X-axis direction.

Third Embodiment

FIG. 7B is a schematic perspective view of a capacitor 10 b according toa variation of the capacitor 10 shown in FIG. 1A. In the outer metalterminal 30 of the capacitor 10 b shown in FIG. 7B, reinforcement pieces36 f are formed on the terminal body 36 in a lower position of thenon-joint region 50 b failing to overlap with the joint regions 50 a inthe Z-axis direction (the pair of engagement arm portions 31 a and 31 bfaces each other (the same applies to 33 a and 33 b/no mentionhereinafter)). The pair of reinforcement pieces 36 f is bent inward fromboth sides of the terminal body 36 in the X-axis direction toward thecapacitor chips 20 (Y-axis direction). The pair of reinforcement pieces36 f is formed on the terminal body 36 so as to face each other in theX-axis direction.

Each of the reinforcement pieces 36 f has a length Z1 in the Z-axisdirection determined to include at least the non-joint region 50 b fromthe lower edge of the joint region 50 a to the lower arm portion 31 b.Preferably, the length Z1 is determined so as not to overlap with thejoint region 50 a and so as to overlap with a height L4 of the secondthrough hole 36 c in the Z-axis direction shown in FIG. 3A.

Preferably, each of the reinforcement pieces 36 f shown in FIG. 7B has alength Z1 in the Z-axis direction determined to further overlap with awidth of the slit 36 d in the Z-axis direction shown in FIG. 3A.Moreover, each of the reinforcement pieces 36 f shown in FIG. 7Bpreferably has a length Z1 in the Z-axis direction determined so as notto contact with the mount portion 38 and so as to maintain apredetermined gap Z2 between the reinforcement piece 36 f and the mountportion 38. The gap Z2 is not limited, but is preferably 0.2 to 0.5 mm.

A length Y1 of each of the reinforcement pieces 36 f from the terminalbody 36 is not limited, but is determined, for example, based on arelation with a length Y2 of the mount portion 38 in the Y-axisdirection (see FIG. 2). Preferably, Y1/Y2 is 0.2 to 0.6. Alternately, alength Y1 of each of the reinforcement pieces 36 f from the terminalbody 36 is determined based on a relation with a length Y3 of theengagement arm portion 31 b in the Y-axis direction (see FIG. 2).Preferably, Y1/Y3 is 0.3 to 0.8.

Since the reinforcement pieces 36 f are formed on the terminal body 36in a lower position of the non-joint region 50 b failing to overlap withthe joint regions 50 a in the Z-axis direction (the pair of engagementarm portions 31 a and 31 b faces each other (the same applies to 33 aand 33 b/no mention hereinafter)), the strength of the terminal body 36is reinforced in the non-joint region 50 b (no overlap with the jointregions 50 a). Thus, the capacitor chip 20 is stably held by the pair ofengagement arm portions 31 a and 31 b, and the capacitor chip 20 and theouter metal terminal 30 can securely and firmly be connected. Since alower part of the non-joint region 50 b, which is easily deformable, isreinforced, even if a substrate (not illustrated) is deformed while thecapacitor 10 is mounted on the substrate, a strong connection betweenthe capacitor chip 20 and the outer metal terminal 30 is maintained, andthe outer metal terminal 30 or the capacitor chip 20 is not damaged verymuch.

Since the reinforcement pieces 36 f are formed on the terminal body 36in a lower part of the non-joint region 50 b failing to overlap with thejoint regions 50 a, the non-joint gap 50 d is easily secured and easilydemonstrates advantages (e.g., prevention effect on acoustic noise),compared to when the reinforcement pieces 36 f are formed to overlapwith the joint regions 50 a.

In the present embodiment, since the reinforcement pieces 36 f areformed in pairs on both sides of the terminal body 36 in the X-axisdirection as shown in FIG. 7B, the pair of arm portions 31 a and 31 bholds the capacitor chip 20 without being disturbed by the reinforcementpieces 36 f.

Since the reinforcement pieces 36 f are formed at a position where theterminal body 36 with the second through holes 36 c and the slits 36 dhas a low strength, the strength at this position can favorably bemaintained.

Since the reinforcement pieces 36 f are not directly in contact with themount portion 38, a solder can effectively be prevented from creeping upfrom the mount portion 38 (solder bridge). Incidentally, thereinforcement pieces 36 f are indirectly connected with the mountportion 38 via the terminal body 36, and the reinforcement pieces 36 fand the mount portion 38 are not directly in contact with each other.

The reinforcement pieces 36 f overlap with the capacitor chips 20 in theZ-axis direction, but do not directly connect with the capacitor chips20 due to the gap as shown in FIG. 7B. In this structure, vibrationsfrom the capacitor chips 20 to the reinforcement pieces 36 f can beprevented while the low profile of the capacitor 10 is achieved.Moreover, even if a substrate (not illustrated) is deformed aftermounting, the reinforcement pieces 36 f are also deformed in accordancewith the deformation of the substrate, absorb it, and are not connectedwith the capacitor chips 20, and the capacitor chips 20 are not therebydamaged very much by the deformation of the substrate.

In the present embodiment, since the reinforcement pieces 36 f are bentinward toward the capacitor chips 20, not away from the capacitor chips20, the capacitor chips 20 can effectively be protected from impactsfrom outside while the capacitor 10 is downsized. Incidentally, theouter metal terminal 30 is mainly described in the above description,but the same applies to the outer metal terminal 40.

Fourth Embodiment

FIG. 8 is a schematic perspective view of a capacitor 100 according toanother embodiment of the present invention. As shown in FIG. 8, thecapacitor 100 is similar to the capacitor 10 according to FirstEmbodiment or the capacitor 10 a according to Second Embodiment exceptthat the capacitor 100 has six capacitor chips 20 and has a differentnumber of first through holes 36 b, etc. contained in first and secondmetal terminals 130 and 140 and a different number of engagement armportions 63 a, 64 a, etc. contained in an intermediate metal terminal160. In the description of the capacitor 100, similar parts to thecapacitor 10 or 10 a are thereby provided with similar references to thecapacitor 10 or 10 a and are not described.

As shown in FIG. 8, the capacitor chips 20 contained in the capacitor100 are similar to the capacitor chips 20 contained in the capacitor 10shown in FIG. 1. The three capacitor chips 20 on one side in the Y-axisdirection contained in the capacitor 100 are arranged in parallel to amount surface so that the first terminal electrodes 22 of the adjacentcapacitor chips 20 contact with each other, and that the second terminalelectrodes 24 of the adjacent capacitor chips 20 contact with eachother. The three capacitor chips 20 on the other side in the Y-axisdirection contained in the capacitor 100 are arranged in parallel to amount surface so that the first terminal electrodes 22 of the adjacentcapacitor chips 20 contact with each other, and that the second terminalelectrodes 24 of the adjacent capacitor chips 20 contact with eachother.

The intermediate metal terminal 160 contained in the capacitor 100 has aconnection portion 161. The engagement arm portions 63 a, 63 b, and 63 cprotruding toward one side in the Y-axis direction and the engagementarm portions 64 d and 64 e protruding toward the other side in theY-axis direction are formed at the upper end of the connection portion161. Each of the engagement arm portions 63 a, 63 b, and 63 c is incontact with the single capacitor chip 20 on one side in the Y-axisdirection. Each of the engagement arm portions 64 d and 64 e is incontact with both of the multiple (two) capacitor chips 20 on the otherside in the Y-axis direction so as to cover them. The engagement armportions 64 d and 64 e are formed to be wider than the engagement armportions 63 a, 63 b, and 63 c in the X-axis direction.

Although not illustrated in detail, the lower end of the connectionportion 161 is provided with two engagement arm portions having similarstructure to the engagement arm portions 64 d and 64 e and protrudingtoward one side in the Y-axis direction and three engagement armportions having similar structure to the engagement arm portions 63 a,63 b, and 63 c and protruding toward the other side in the Y-axisdirection.

The first metal terminal 130 contained in the capacitor 100 has aterminal body 136, three pairs of engagement arm portions 31 a, 31 b, 33a, 33 b, 35 a, and 35 b, and a mount portion 138. The terminal body 136faces the first terminal electrodes 22. The three pairs of engagementarm portions 31 a, 31 b, 33 a, 33 b, 35 a, and 35 b hold the capacitorchips 20. The mount portion 138 is bent perpendicularly from a terminalsecond side 136 hb of the terminal body 136 toward the capacitor chips20. The terminal body 136 has a substantially rectangular flat shape andhas a pair of terminal first sides 136 g approximately parallel to thechip first sides 20 g and a pair of terminal second sides 136 ha and 136hb approximately parallel to the chip second sides 20 h.

As is the case with the first outer metal terminal 30 shown in FIG. 1A,the first outer metal terminal 130 is provided with the protrusions 36a, the first through holes 36 b, the second through holes 36 c, and theslits 36 d. The first metal terminal 130 is, however, provided withthree first through holes 36 b, three second through holes 36 c, andthree slits 36 d, and one first through hole 36 b, one second throughhole 36 c, and one slit 36 d correspond with one capacitor chip 20. Thefirst metal terminal 130 is provided with 12 protrusions 36 a in total,and the four protrusions 36 a correspond with each of the capacitorchips 20.

In the first metal terminal 130, the upper arm portion 31 a and thelower arm portion 31 b hold one of the capacitor chips 20, the upper armportion 33 a and the lower arm portion 33 b hold another one of thecapacitor chips 20, and the upper arm portion 35 a and the lower armportion 35 b hold another one of the capacitor chips 20 that isdifferent from the above two capacitor chips 20. The upper arm portions31 a, 33 a, and 35 a are connected with the terminal second side 136 haat the upper part of the terminal body 136 (upper side in the Z-axisdirection), and the lower arm portions 31 b, 33 b, and 35 b areconnected with periphery portions of the second through holes 36 c.

The mount portion 138 of the first metal terminal 130 is connected withthe terminal second side 136 hb at the lower part of the terminal body136 (negative side in the Z-axis direction). The mount portion 138extends from the terminal second side 136 hb toward the capacitor chips20 (back in the Y-axis direction) and is bent approximatelyperpendicularly to the terminal body 136.

The second metal terminal 140 has a terminal body 146, a plurality ofpairs of engagement arm portions 41 a, 41 b, 43 a, 43 b, 45 a, and 45 b,and a mount portion 148. The terminal body 146 faces the second terminalelectrodes 24. The engagement arm portions 41 a, 41 b, 43 a, 43 b, 45 a,and 45 b sandwich and hold the capacitor chips 20 from both ends of thechip first sides 20 g in the Z-axis direction. The mount portion 148extends from the terminal body 146 toward the capacitor chips 20 and isat least partially approximately perpendicular to the terminal body 146.

As is the case with the terminal body 136 of the first metal terminal130, the terminal body 146 of the second metal terminal 140 has a pairof terminal first sides 146 g approximately parallel to the chip firstsides 20 b and a terminal second side 146 ha approximately parallel tothe chip second sides 20 h, and the terminal body 146 is provided withthe protrusions 46 a, first through holes, second through holes, andslits. The second metal terminal 140 is arranged symmetrically to thefirst metal terminal 130 and is different from the first metal terminal130 in arrangement to the capacitor chips 20. The second metal terminal140 is, however, different from the first metal terminal 130 only inarrangement and has a similar shape to the first metal terminal 130.Thus, the second metal terminal 140 is not described in detail.

The capacitor 100 according to the present embodiment has similareffects to those of the capacitor 10 according to First Embodiment.Incidentally, each number of upper arm portions 31 a to 35 a, lower armportions 31 b to 35 b, first through holes 36 b, second through holes 36c, and slits 36 d contained in the first metal terminal 130 of thecapacitor 100 is the same as the number of capacitor chips 20 containedin the capacitor 100, but the number of engagement arm portions or socontained in the capacitor 100 is not limited thereto. For example, thefirst metal terminal 130 may be provided with twice as many firstthrough holes 36 b as the capacitor chips 20, or may be provided with asingle long slit 36 d continuing in the X-axis direction.

The number of capacitors 20 may be seven or more. In this case, theconnection portion 161 of the intermediate metal terminal 160 has awidth in the X-axis direction that is approximately equal to a lengthobtained by multiplying the number of capacitor chips 20 arranged on oneside or the other side of the capacitor 10 in the Y-axis direction witha width of the capacitor chip 20 in the X-axis direction.

Fifth Embodiment

FIG. 3B is a left-side view illustrating a capacitor 300 according toanother embodiment of the present invention. The capacitor 300 accordingto the present embodiment is similar to the capacitor 10 according toFirst Embodiment or the capacitor 10 a according to Second Embodimentexcept for the shape of slits 336 d formed on first and second metalterminals 330. As shown in FIG. 3B, the first and second metal terminals330 are provided with a single slit 336 d formed below the two secondthrough holes 36 c and continuing in the X-axis direction. The slit 336d has any shape and number as long as the slit 336 d is formed betweenlower edges (chip second sides 20 h) of the capacitor chips 20 facingthe first end surfaces 20 a and the terminal second side 36 hb (i.e.,terminal connection part 36 k).

Sixth Embodiment

FIG. 3C is a left-side view illustrating a capacitor 400 according tofurther another embodiment of the present invention. The capacitor 400according to the present embodiment is similar to the capacitor 10according to First Embodiment or the capacitor 10 a according to SecondEmbodiment except for the shape of second through holes 36 c formed onfirst and second metal terminals 430. As shown in FIG. 3C, one secondthrough hole 36 c continuing in the X-axis direction is formed in thefirst and second metal terminals 430. The second through hole 36 c isformed in the terminal body 36 so that a part of the terminal electrodes22 (part of lower portion) corresponding to the inner electrode layers26 at the lower part (Z-axis direction) of the chips 20 adjacent to eachother is exposed to the outside.

In the present embodiment, a width of the second through hole 36 c inthe X-axis direction is preferably smaller than a total width of themultiple chips 20 in the X-axis direction, and is preferably ⅙ to ⅚,more preferably ⅓ to ⅔, of a total width of the chips 20 in the X-axisdirection.

Seventh Embodiment

FIG. 3D is a left-side view illustrating a capacitor 600 according tofurther another embodiment of the present invention. The capacitor 600according to the present embodiment is similar to the capacitor 10according to First Embodiment or the capacitor 10 a according to SecondEmbodiment except that two capacitor chips 20 are connected in seriesvia an intermediate metal terminal (not illustrated) and are connectedto first and second metal terminals 630. In the present embodiment,similar effects to First Embodiment and Second Embodiment aredemonstrated.

OTHER EMBODIMENTS

Incidentally, the present invention is not limited to theabove-mentioned embodiments, and may variously be changed within thescope of the present invention.

For example, the outer metal terminals 30, 130, 40, 140, 330, 430, and630 are provided with the protrusions 36 a, the first through hole 36 b,and the slit 36 d (or 336 d) as necessary, but the metal terminal of thepresent invention is not limited to these metal terminals, and theelectronic device of the present invention includes a variation whereone or more of these components are not formed.

In the present invention, the number of chips owned by the electronicdevice is any plural. Moreover, for example, all of the arm portions 31a, 31 b, 33 a, and 33 b shown in FIG. 1A are in contact with the firstterminal electrode 22 of the capacitor chips 20 in First Embodiment, butnot all of the arm portions 31 a, 31 b, 33 a, and 33 b need to be incontact with the first terminal electrode 22 after the joint regions 50a are formed. This is also the case with the other embodiments.

Moreover, for example, the reinforcement pieces 36 f are formed so asnot to overlap with the joint regions 50 a in First Embodiment shown inFIG. 7B, but the upper end of the reinforcement piece 36 f in the Z-axisdirection may partially overlap with the joint region 50 a. For example,each of the reinforcement pieces 36 f has a length Z1 in the Z-axisdirection determined so that a length of an overlapping region betweenthe reinforcement piece 36 f and the joint region 50 a in the Z-axisdirection is preferably 80% or less (more preferably 50% or less, stillmore preferably 30% or less) of a length of the joint region 50 a in theZ-axis direction. This is also the case with the other embodimentsmentioned above.

In First Embodiment mentioned above, as shown in FIG. 1C, engagement armportions may be provided at both ends (ends on both sides) of theconnection portion 61 in the X-axis direction. In an intermediateterminal 60 a shown in FIG. 1C, an engagement arm portion 65 aprotruding toward one side in the Y-axis direction is formed at a sideend of the connection portion 61 on one side in the X-axis direction (onthe positive side in the X-axis direction), and an engagement armportion 65 b protruding toward one side in the Y-axis direction isformed at a side end of the connection portion 61 on the other side inthe X-axis direction (on the negative side in the X-axis direction). Theengagement arm portion 66 a protruding toward the other side in theY-axis direction is formed at one end of the connection portion 61 inthe Z-axis direction, and the engagement arm portion 66 b protrudingtoward the other side in the Y-axis direction is formed at the other endof the connection portion 61 in the Z-axis direction.

In this structure, two capacitor chips 20 connected to the firstconnection surface 611 of the connection portion 61 can laterally besandwiched and held together by the engagement arm portions 65 and 65 b.

In First Embodiment mentioned above, as shown in FIG. 1D, engagement armportions may be provided at four corners of the connection portion 61.In an intermediate metal terminal 60 b shown in FIG. 1D, an engagementarm portion 67 a protruding toward one side in the Y-axis direction isformed at a corner between one side of the connection portion 61 in theX-axis direction and one side of the connection portion 61 in the Z-axisdirection, an engagement arm portion 67 b protruding toward one side inthe Y-axis direction is formed at a corner between the other side of theconnection portion 61 in the X-axis direction and the other side of theconnection portion 61 in the Z-axis direction, an engagement arm portion68 a protruding toward the other side in the Y-axis direction is formedat a corner between one side of the connection portion 61 in the X-axisdirection and the other side of the connection portion 61 in the Z-axisdirection, and an engagement arm portion 68 b protruding toward theother side in the Y-axis direction is formed at a corner between theother side of the connection portion 61 in the X-axis direction and oneside of the connection portion 61 in the Z-axis direction. Theengagement arm portions 67 a, 67 b, 68 a, and 68 b have an approximatelyL shape and are bent along each corner by about 90 degrees.

In this structure, two capacitor chips 20 connected to the firstconnection surface 611 of the connection portion 61 can be sandwichedand held together from lateral, above, and below by the engagement armportions 67 a and 67 b, and two capacitor chips 20 connected to thesecond connection surface 612 of the connection portion 61 can besandwiched and held together from lateral, above, and below by theengagement arm portions 68 a and 68 b.

In the above-mentioned embodiments, as shown in, for example, FIG. 1B,the engagement arm portions 63 c, 64 a, and 64 b connected to the lowerend of the connection portion 61 are in contact with the terminalelectrodes 22 and 24 of each of the capacitor chips 20, but a gap in theZ-axis direction may be formed between the engagement arm portions 63 c,64 a, and 64 b and the terminal electrodes 22 and 24.

In the above-mentioned embodiments, the lower end of the connectionportion 61 in the Z-axis direction may further be extended downward inthe Z-axis direction so that the engagement arm portions 63 c, 64 a, and64 b shown in FIG. 1B can be connected to a mount board.

In the above-mentioned embodiments, the number of capacitor chips 20connected to the first connection surface 611 of the intermediate metalterminal 60 may be different from the number of capacitor chips 20connected to the second connection surface 612 of the intermediate metalterminal 60. For example, two capacitor chips 20 may be connected to thefirst connection surface 611, and one capacitor chip 20 may be connectedto the second connection surface 612.

NUMERICAL REFERENCES

-   10, 10 a, 100, 300, 400, 600 . . . capacitor-   20 . . . capacitor chip-   20 a . . . first end surface-   20 b . . . second end surface-   20 c . . . first side surface-   20 d . . . second side surface-   20 e . . . third side surface-   20 f . . . fourth side surface-   20 g . . . chip first side-   20 h . . . chip second side-   20 j . . . chip third side-   22 . . . first terminal electrode-   24 . . . second terminal electrode-   26 . . . internal electrode layer-   28 . . . dielectric layer-   30, 130, 40, 140, 330, 430, 530 . . . metal terminal-   31 a, 33 a, 35 a, 41 a, 43 a, 45 a . . . upper arm portion (holding    piece)-   31 b, 33 b, 35 b, 41 b, 43 b . . . lower arm portion (holding piece)-   36, 136, 46, 146 . . . terminal body-   36 a, 46 a . . . protrusion-   36 b . . . first through hole-   36 c . . . second through hole-   36 c 1 . . . non-opening region-   36 d, 46 d . . . slit-   36 f . . . reinforcement piece-   36 g . . . terminal first side-   36 ha, 36 hb . . . terminal second side-   38, 138, 48, 148 . . . mount portion-   50 . . . connection member-   50 a . . . joint region-   50 b . . . non-joint region-   50 c . . . initial application region-   50 d . . . non-joint gap-   60, 60 a, 60 b . . . intermediate metal terminal-   61 . . . connection portion-   611 . . . first connection surface-   612 . . . second connection surface-   63 a, 63 b, 63 c, 64 a, 64 b, 64 c, 64 d, 64 e, 65 a, 65 b, 66 a, 66    b, 67 a, 67 b, 68 a, 68 b . . . engagement arm portion

What is claimed is:
 1. An electronic device comprising: a plurality ofchip components; an intermediate metal terminal configured to connectend surfaces of terminal electrodes of the chip components; and an outermetal terminal connectable to the terminal electrode positioned oppositeto the terminal electrode connectable to the intermediate metalterminal, wherein the intermediate metal terminal includes a firstconnection surface directed to one side in a first axis direction, asecond connection surface directed to the other side in the first axisdirection, and a plurality of holding pieces for sandwiching and holdingthe chip components, the intermediate metal terminal is arranged so asto be sandwiched between a chip component connected to the firstconnection surface and a chip component connected to the secondconnection surface, and the plurality of holding pieces include a firstholding piece holding the chip component connected to the firstconnection surface and a second holding piece holding the chip componentconnected to the second connection surface.
 2. The electronic deviceaccording to claim 1, wherein a terminal electrode of a chip componentdiffering from the plurality of chip components is connected to onesurface or the other surface of the intermediate metal terminal.
 3. Theelectronic device according to claim 1, wherein the holding pieces arerespectively formed on one end or the other end of the intermediatemetal terminal and are arranged to be shifted so as not to overlap witheach other when viewed from one end or the other end of the intermediatemetal terminal.
 4. The electronic device according to claim 2, whereinthe holding pieces are respectively formed on one end or the other endof the intermediate metal terminal and are arranged to be shifted so asnot to overlap with each other when viewed from one end or the other endof the intermediate metal terminal.
 5. The electronic device accordingto claim 1, wherein each of the holding pieces is in contact with asingle chip component or the plurality of chip components.
 6. Theelectronic device according to claim 2, wherein each of the holdingpieces is in contact with a single chip component or the plurality ofchip components.
 7. The electronic device according to claim 3, whereineach of the holding pieces is in contact with a single chip component orthe plurality of chip components.
 8. The electronic device according toclaim 4, wherein each of the holding pieces is in contact with a singlechip component or the plurality of chip components.
 9. The electronicdevice according to claim 5, wherein the holding piece in contact withthe plurality of chip components is wider than the holding piece incontact with the single chip component.
 10. The electronic deviceaccording to claim 6, wherein the holding piece in contact with theplurality of chip components is wider than the holding piece in contactwith the single chip component.
 11. The electronic device according toclaim 7, wherein the holding piece in contact with the plurality of chipcomponents is wider than the holding piece in contact with the singlechip component.
 12. The electronic device according to claim 8, whereinthe holding piece in contact with the plurality of chip components iswider than the holding piece in contact with the single chip component.13. The electronic device according to claim 1, comprising a pair ofouter metal terminals, wherein each of the plurality of holding piecesprotrudes toward one of the outer metal terminals or the other outermetal terminal.
 14. The electronic device according to claim 3,comprising a pair of outer metal terminals, wherein each of theplurality of holding pieces protrudes toward one of the outer metalterminals or the other outer metal terminal.
 15. The electronic deviceaccording to claim 5, comprising a pair of outer metal terminals,wherein each of the plurality of holding pieces protrudes toward one ofthe outer metal terminals or the other outer metal terminal.
 16. Theelectronic device according to claim 9, comprising a pair of outer metalterminals, wherein each of the plurality of holding pieces protrudestoward one of the outer metal terminals or the other outer metalterminal.
 17. An electronic device comprising: a plurality of chipcomponents; an intermediate metal terminal configured to connect endsurfaces of terminal electrodes of the chip components; and an outermetal terminal connectable to the terminal electrode positioned oppositeto the terminal electrode connectable to the intermediate metalterminal, wherein the intermediate metal terminal includes a pluralityof holding pieces for sandwiching and holding the chip components, andthe holding pieces are respectively formed on one end or the other endof the intermediate metal terminal and are arranged to be shifted so asnot to overlap with each other when viewed from one end or the other endof the intermediate metal terminal.
 18. An electronic device comprising:a plurality of chip components; an intermediate metal terminalconfigured to connect end surfaces of terminal electrodes of the chipcomponents; and an outer metal terminal connectable to the terminalelectrode positioned opposite to the terminal electrode connectable tothe intermediate metal terminal, wherein the intermediate metal terminalincludes a plurality of holding pieces for sandwiching and holding thechip components, each of the holding pieces is in contact with a singlechip component or the plurality of chip components, the holding piece incontact with the plurality of chip components is wider than the holdingpiece in contact with the single chip component.
 19. An electronicdevice comprising: a plurality of chip components; an intermediate metalterminal configured to connect end surfaces of terminal electrodes ofthe chip components; and an outer metal terminal connectable to theterminal electrode positioned opposite to the terminal electrodeconnectable to the intermediate metal terminal, wherein the intermediatemetal terminal includes a plurality of holding pieces for sandwichingand holding the chip components, the plurality of holding piecesincludes holding pieces in contact with a single chip component, andholding pieces in contact with multiple chip components.